Photonic scale-up and scale-out solutions
Photonic expertise, from light to data center
Fabless photonic IP and interconnect modules, with solutions spanning GlobalFoundries, Samsung, and TSMC platforms.
Explore our offeringA deliberately senior team
374+
combined years of engineering experience across the team
2nm
silicon-proven delivery on both Samsung and TSMC
81%
of our engineers with more than ten years of experience
What we do
Photonic interconnect for memory disaggregation, and the packaged optical engines that carry it.
Memory Disaggregation over Photonic Interconnect
Break the memory wall: pool capacity and bandwidth away from the compute die and reach it over light, at rack scale and with near-local latency.
- AOPHBM4: our photonic HBM4 interface, moving high-bandwidth memory traffic off copper and onto an optical link
- Scale-up: disaggregated memory pools shared across accelerators in the same rack, without per-node overprovisioning
- Scale-out: optical die-to-die and die-to-memory reach beyond the package, from co-packaged optics to rack-to-rack
Packaged optical engines
Packaged optical engines that put the light where the bandwidth is needed, from the front panel to inside the package.
- CPO: co-packaged optics, with the optical engine in the same package as the switch or accelerator die, cutting electrical reach to millimetres
- XPO: extra-dense pluggable optics, for front-panel density without moving the optics inside the package
- NPO: near-package optics, with engines on the substrate beside the ASIC as the step between pluggable and fully co-packaged
- Open CPX: an open, multi-vendor co-packaged form factor, keeping the optical engine interoperable across suppliers
Markets we serve
Photonic interconnect applied where bandwidth, reach and packaging constraints decide the architecture.
Data-centre & AI
Optical die-to-die and memory links for AI compute at rack scale, where copper reach and power stop scaling.
Enterprise
Optical interconnect for private cloud and on-premise compute, from server front panels to co-packaged engines.
Robotics
Low-latency optical links and precision converters for sensing and high-speed compute in autonomous machines.
Industrial
Photonic and mixed-signal interfaces for measurement, control and industrial connectivity at long reach.
Automotive
High-reliability interconnect experience for Tier-1 programmes that need bandwidth without copper mass.
Space
Radiation-aware analog and photonic link design for the environments where copper and connectors fail first.
Quantum
Photonic interconnect and cryo-compatible control links for quantum processors and their classical read-out.